Achray Photonics provides a number of solutions in the area of RF design and assembly.
We offer following services:
	
	- High speed ceramic carrier design up to 80 GHz
        
- Microwave module design and prototyping
	
- Design of RF coplanar or microstrip lines inside the package, connecting high speed device to another device or connector in package wall
	
- RF solutions for directly modulated Lasers, Detectors, Modulators, Detector and Laser Arrays
        
- 2d and 3d RF modeling, optimization of s-parameters and package crosstalk reduction, package resonances
	
- V-connector packages with transitions to ceramic submounts
	
- K-connector, GPO, GPPO and SMA packages
        
- Packages with multiple RF connectors
        
- Development of packages with high-speed, multi-layer ceramic feedthroughs
        
- RF test jigs 
        
- SMD and MiniDIL packages
	
- Ceramic hybrids with multiple RF devices
        
- Assembly of RF submounts and modules
        
- Amplifier selection and integration with optoelectronic devices