At Achray Photonics each packaging solution is developed based on
our expertise as well as extensive modeling. Each device-fiber coupling scheme
is uniquely designed to provide high coupling efficiency and environmental stability
of the packaged device.
Thermal design is optimized to ensure the widest possible operating temperature range with a
thermo-electric cooler for optoelectronic devices requiring stable thermal conditions, independent of the
ambient temperature. We have an extensive expertise in hermetic packaging solutions
for all kinds of optoelectronic components, ranging from PINs and APDs to external modulators
and hybridly integrated, multifunctional devices.
High speed electrical design, supported by our RF modeling tools, is available to make
sure that the packaged component meets specifications of s-parameters and cross-talk in the case of
multiple high speed connections.
We provide our customers with optoelectronic packaging services in the following areas: