At Achray Photonics we believe that modeling is a very important tool
in the design of every modern opto-electronic packaging solution.
Modeling can cut cost and help reduce risk associated with every new
packaging development.
We provide our customers with modeling and design services in the
following areas:
- Optical,
includes selection of optical components to provide
optimum coupling efficiency into a single mode fiber or an array
of fibers (lenses, lensed fibers etc.)
as well as isolators, beam splitters and other optical components
co-packaged with the device.
- Thermal Steady State
includes selection of thermally conductive materials,
predicting and optimizing temperature drop between the active
device and the package, producing temperature maps,
selecting and predicting performance of Thermo-Electric Coolers.
- Transient Thermal
to help determine time constants and thermal interaction
of multiple devices.
- Mechanical and Thermal Stress
aimed at reducing effects of thermal and mechanical
factors on optical performance of the packaged device.
- RF
includes design and evaluation of high speed microstrip and
coplanar
connections to the packaged devices, optimizing s-parameters,
reducing crosstalk and resonances, speeds up to 50 GHz,
